Pre-matched module for an ultra-high frequency diode with high heat dissipation
US4566027A · kind A · utility
7Cited by
3References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 21, 1983 |
| Grant date | Jan 21, 1986 |
| Priority date | — |
| Expiry date | Nov 21, 2003 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A pre-matched module is provided for an ultra-high frequency diode with high heat dissipation, comprising a diode chip biassed by a connection and mounted inside a case formed by a metal base, a quartz ring and a metal cap. The base of the case comprises two fixed and metal-coated diamonds one of which has dimensions very much greater than those of the other central diamond, these two diamonds allowing the heat released by the diode to be removed to a maximum and allowing the cap to provide, because of its dimensions and those of the diamond and of the ring, good radial impedance transformation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.