Multilayer interconnect circuitry using photoimageable dielectric
US4566186A · kind A · utility
61Cited by
8References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 1984 |
| Grant date | Jan 28, 1986 |
| Priority date | — |
| Expiry date | Jun 29, 2004 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of fabricating multilayer printed circuit boards using polymer thick film technology is disclosed which utilizes photoimageable dielectric material between conductive polymer thick film layers and which is capable of producing extremely small and uniformly-sized vias.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.