Apparatus and method of setting up apparatus for shaping and trimming the leads of integrated components
US4566503A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 13, 1983 |
| Grant date | Jan 28, 1986 |
| Priority date | — |
| Expiry date | Dec 13, 2003 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49004
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
This invention provides an apparatus and method of setting up apparatus for the automatic cutting and/or shaping of IC components carried in a tubular carrier and advanced for processing by gravity. A base plate is disposed at an angle of approximately forty degrees to the horizontal and provides a supporting means for gravitational feeding of these components from a removable U-shaped retainer to a guide and then to a die station. At this die station a resiliently tired feed wheel engages the body of the IC component which is metered and advanced with an intermittent motion. This motion is provided in a timed relationship with two rotating shafts which have pins moved in a precise orbit around a shaft centerline. These pins are one-hundred-eighty degrees out-of-phase with each other. The rotated feed wheel and attached tire are intermittently moved in a strict timed relationship to the movement of the two shafts by a one-way clutch driven by one of the shafts and by an eccentrically moved Pitman arm. The several stations in this apparatus retain these components by clamp means and manipulable thumb screws.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.