Patent · US Expired

Semiconductor component with a disc-shaped case

US4567504A · kind A · utility

1Cited by

8References

5Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Werner Egerbacher · Munich, DE
Dieter Wunderlich · Olching, DE

Key dates

Filing date	Mar 14, 1984
Grant date	Jan 28, 1986
Priority date	—
Expiry date	Mar 14, 2004

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Semiconductor component with a disc-shaped case, including a ceramic ring having an inner surface, two metal discs, metal rings connecting the metal discs to the ceramic ring, a semiconductor body disposed in the case between the metal discs, an additional metal ring fastened to the periphery of each of the metal discs within the case, at least one electrically and thermally insulating foil having a high energy of evaporation disposed between the semiconductor body and the ceramic ring covering the inner surface of the ceramic ring and overlapping the additional metal rings.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.