Heat sink and method of attaching heat sink to a semiconductor integrated circuit and the like
US4567505A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 27, 1983 |
| Grant date | Jan 28, 1986 |
| Priority date | — |
| Expiry date | Oct 27, 2003 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Two bodies such as an integrated circuit and a heat sink are maintained in a low stress and high thermal conductance abutment by pressure from capillary attraction. A surface of one of the bodies is provided with grooves preferably having reentrant surfaces. A surface of the other body is brought into abutment with the grooved surface with a liquid therebetween which partially fills the grooves. The grooves act as reservoirs for excess liquid so that a minimum thickness liquid interface is achieved, and the grooves enable trapped gas to escape out the open ends thereby preventing voids between the two bodies. Importantly, the groove geometry enforces a well-defined attractive force between the two surfaces due to the liquid surface tension.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.