Multilayer ceramic substrate with interlayered capacitor
US4567542A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 23, 1984 |
| Grant date | Jan 28, 1986 |
| Priority date | — |
| Expiry date | Apr 23, 2004 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4688
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer ceramic substrate with an interlayered capacitor has a large electrostatic capacity and a high flexural strength, such as 1,500 Kg/cm.sup.2 or more, and yet is manufactured at a relatively low firing or sintering temperature. A first ceramic body includes a plurality of laminated first ceramic sheets with a high dielectric constant and with a plurality of internal electrodes sandwiching the respective first ceramic sheets to form capacitors therebetween. A second ceramic body is laminated over one side of the first ceramic body and has a plurality of laminated second ceramic sheets with a low dielectric constant. A plurality of first wiring layers are sandwiched between the second ceramic sheets. A third ceramic body is laminated over the other side of the first ceramic body and has a plurality of laminated third ceramic sheets formed of the same ceramic material that is used to make the second ceramic sheets. The second and third ceramic bodies are thicker than the first ceramic body. A second embodiment of the invention is a hybrid ceramic structure made of glass-ceramic insulator layers sandwiching at least one dielectric layer with interposed circuit patterns forme…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.