Precision marking of layers
US4568409A · kind A · utility
31Cited by
3References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 17, 1983 |
| Grant date | Feb 4, 1986 |
| Priority date | — |
| Expiry date | Nov 17, 2003 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/94
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Selective incision of metallic layers overlying semiconductors by laser ablation (evaporation) of selected regions of a dye sensitized coating on each such metallic layer, followed by etching of the metallic layer to avoid objectionable alloying by laser scribing of the metallic layer to provide the desired incisions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.