Anisotropically electroconductive film adhesive
US4568592A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 12, 1985 |
| Grant date | Feb 4, 1986 |
| Priority date | — |
| Expiry date | Apr 12, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/269
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A film adhesive of a thermoplastic or thermosetting polymeric insulative material can be imparted with anisotropic electroconductivity by dispersing electroconductive fibrils of specified dimensions therein in orientation each lying within a plane substantially parallel to the surface of the film adhesive. The film adhesive is useful in adhesively bonding two circuit boards each having a plurality of electric terminals to be electrically connected each on one circuit board to the oppositely positioned terminal on the other circuit board. The orientation of the fibrils in a plane parallel to the surface of the film adhesive may be either unidirectional or at random.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.