Hot melt poly(butylene/ethylene) adhesives
US4568713A · kind A · utility
49Cited by
12References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 30, 1984 |
| Grant date | Feb 4, 1986 |
| Priority date | — |
| Expiry date | May 30, 2004 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/02
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Hot melt adhesives with long open time and good cold metal bonding are made of blends of an at least partially crystalline copolymer of butene-1 and ethylene, an aliphatic, substantially non-polar resin, an antioxidizing agent and, optionally, microcrystalline wax.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.