Rapid curing epoxy resin adhesive composition
US4569956A · kind A · utility
4Cited by
5References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 8, 1984 |
| Grant date | Feb 11, 1986 |
| Priority date | — |
| Expiry date | Aug 8, 2004 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L63/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention provides a rapid, low-temperature curing epoxy resin adhesive composition comprising (1) a polyepoxide, (2) a catalytic amount of HBF.sub.4, (3) a finely divided filler, preferably an acidic filler, and, optionally, (4) a polyalkylene ether glycol.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.