Thermoplastic molding of ceramic powder
US4571414A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 11, 1984 |
| Grant date | Feb 18, 1986 |
| Priority date | — |
| Expiry date | Apr 11, 2004 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K3/013
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A thermoplastically moldable ceramic composition comprised of from about 40% to about 60% by volume of a ceramic powder and a binder comprised of an organic acid and a copolymer of ethylene and from greater than about 12 weight % to about 33 weight % vinyl acetate, said organic acid having a melting point ranging from about 44.degree. C. to about 88.degree. C. and ranging from greater than about 18% by weight up to about 45% by weight of the binder. The ceramic composition is thermoplastically molded into a body which is baked to remove the binder and then densified to produce a polycrystalline body having a porosity of less than about 20% by volume.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.