Apparatus for feeding wire to a wire bonding mechanism
US4572421A · kind A · utility
14Cited by
3References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 19, 1983 |
| Grant date | Feb 25, 1986 |
| Priority date | — |
| Expiry date | Sep 19, 2003 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus for supplying wire to a wire bonding mechanism is presented. Lengths of wire are fed to a low mass wire-loop reservoir while the bonding process is taking place. Wire is then supplied, at a high speed, from the wire-loop reservoir for the next bonding operation. The amount of wire supplied is precisely measured by measuring the change in the amount of wire stored in the reservoir. The apparatus can supply both single lead wire and twin lead wire. When twin lead wire is supplied, the two wires of the twin lead are separated at predetermined points before being fed to the wire-loop reservoir.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.