Resin encapsulation type semiconductor device
US4572853A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 21, 1984 |
| Grant date | Feb 25, 1986 |
| Priority date | — |
| Expiry date | Feb 21, 2004 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31942
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
There is presented a highly reliable resin encapsulation type semiconductor device excellent in humidity resistance as well as high temperature electrical characteristics. The specific feature consists in the epoxy resin composition employed for encapsulation. This composition comprises an epoxy resin, a novolac resin as curing agent and an organic tertiary phosphine compound as curing accelerator. The resin encapsulation type semiconductor device is markedly small in leak current under hot and humid conditions and has a prolonged life due to difficult deterioration through corrosion of electrodes and aluminum wiring, as compared with those of prior art.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.