Method and means for improved heat removal in compact semiconductor integrated circuits
US4573067A · kind A · utility
117Cited by
3References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 7, 1984 |
| Grant date | Feb 25, 1986 |
| Priority date | — |
| Expiry date | Mar 7, 2004 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip having improved heat dissipation capability. The back surface of a semiconductor chip is provided with microscopic channels defined by fins in intimate contact with the chip. A cover is affixed to the fins to enclose the channels for the laminar flow of coolant fluid. The chip can be mounted in a recessed portion of a dual in-line package (DIP) with conductive tubes integral with the package providing the flow of coolant. Advantageously, the tubes can function as power busses to the integrated circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.