Semiconductor chip mounting system
US4574470A · kind A · utility
33Cited by
2References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 19, 1984 |
| Grant date | Mar 11, 1986 |
| Priority date | — |
| Expiry date | Mar 19, 2004 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12528
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip module with a flat mounting surface is disclosed. A wafer-scale silicon semiconductor chip is provided with electronic circuits formed therein. The chip has a metallized back face and contacts on the opposite, front face. A solder layer secures the metallized back face of the chip to the mounting surface substantially without voids.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.