Process for activating substrates for electroless metallization

US4575467A · kind A · utility

Assignee

• BAYER HEALTHCARE LLC · DE

Inventors

• Kirkor Sirinyan · Bensberg, DE
• Rudolf Merten · Leverkusen, DE
• Henning Giesecke · Cologne, DE
• Gerhard D. Wolf · Dormagen, DE

Key dates

• Filing date: Jun 27, 1984
• Grant date: Mar 11, 1986
• Expiry date: Jun 27, 2004

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C23C18/28
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

Complex compounds of elements of sub-groups 1 and 8 of the periodic table in oxidation stages 1-4 with unsaturated ketones of the formula ##STR1## wherein R.sub.1 and R.sub.4 denote alkyl, cycloalkyl or aryl and PA1 R.sub.2 and R.sub.3 denote hydrogen or alkyl, are outstandingly suitable for activating substrate surfaces for electroless metallization since these complexes are distinguished by a high storage stability. The palladium complexes of but-3-en-2-one and hept-3-en-2-one are preferred.