Process and apparatus for plating onto articles

US4576685A · kind A · utility

Assignee

• SCHERING CORPORATION · US

Inventors

• Daniel L. Goffredo · Riverton, US
• Walter Meyer · Berlin, DE
• Horst Blaising · Berlin, DE

Key dates

• Filing date: Apr 23, 1985
• Grant date: Mar 18, 1986
• Expiry date: Apr 23, 2005

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K3/0085
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A process and apparatus is provided whereby metal is deposited onto articles such as plastics, ceramics and the like for producing printed circuit boards, metal plated ceramics, shielded articles and other plated articles, as part of a generally or substantially continuous process. Prior to plating, also as part of a continuous process while the boards are being generally continuously and horizontally conveyed in horizontal orientation, they are prepared to accept copper on their non-metallic portions, by application of a chemical reducing solution thereto, preferably after previously having been provided with a chemical activation solution thereto. Then the boards are transferred to a vertical orientation and conveyed in vertical orientation through an electroless copper deposition bath, at a reduced rate of travel, during with a copper solution adheres to the thus treated non-metallic portions of the boards, and to the metallic portions of the boards as well. After the plating process is completed in the bath, the boards are preferably retransferred to generally horizontal orientation and conveyed through appropriate completion steps, such as cleaners, rinsers, anti-tarnish steps…