Process of making photopolymer relief plates using an adhesive layer
US4576898A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 9, 1984 |
| Grant date | Mar 18, 1986 |
| Priority date | — |
| Expiry date | Oct 9, 2004 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/027
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Photopolymer relief plates are produced by applying a photopolymerizable relief-forming layer R, which contains a thermal polymerization inhibitor liberating nitrosyl free radicals on ultraviolet irradiation, to a dimensionally stable base which bears an adhesive layer A for the layer R, the layer A containing 0.01 to 10 percent by weight of a compound ##STR1## where R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are identical or different and each is alkyl or R.sup.5 --(O-alkylene).sub.x --, R.sup.5 being H or alkyl and x being 1, 2, 3, 4 or 5, and then exposing, and developing, the layer R in a conventional manner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.