Patent · US Expired

Process of making photopolymer relief plates using an adhesive layer

US4576898A · kind A · utility

26Cited by
3References
9Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 9, 1984
Grant dateMar 18, 1986
Priority date
Expiry dateOct 9, 2004

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG03F7/027
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

Photopolymer relief plates are produced by applying a photopolymerizable relief-forming layer R, which contains a thermal polymerization inhibitor liberating nitrosyl free radicals on ultraviolet irradiation, to a dimensionally stable base which bears an adhesive layer A for the layer R, the layer A containing 0.01 to 10 percent by weight of a compound ##STR1## where R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are identical or different and each is alkyl or R.sup.5 --(O-alkylene).sub.x --, R.sup.5 being H or alkyl and x being 1, 2, 3, 4 or 5, and then exposing, and developing, the layer R in a conventional manner.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.