Polishing pad for a fine finish
US4579564A · kind A · utility
3Cited by
4References
8Claims
0Family size
Inventor
Key dates
| Filing date | Jan 18, 1985 |
| Grant date | Apr 1, 1986 |
| Priority date | — |
| Expiry date | Jan 18, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/902
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A medium for polishing surfaces comprised of very fine silica particles bonded into a resinous foam. The medium is compounded by bubbling ammonia through a mix of polyol and ethyl silicate to generate bonded silica particles of very small size, then adding a di-isocyanate compound to develop the foam.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.