Wafer shape and method of making same
US4579760A · kind A · utility
6Cited by
0References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 8, 1985 |
| Grant date | Apr 1, 1986 |
| Priority date | — |
| Expiry date | Jan 8, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2495
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor wafer shape which when subjected to a simultaneous polishing of both wafer surfaces produces a wafer of superior flatness and surface finish, the said wafer having a diametral cross-sectional shape like that of a "dogbone" wherein the wafer is thinner in its medial region than it is in the peripheral region and has rounded edges, this shape resulting from a chemical thinning operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.