Hard solder alloy for bonding oxide ceramics to one another or to metals
US4580714A · kind A · utility
9Cited by
3References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 16, 1984 |
| Grant date | Apr 8, 1986 |
| Priority date | — |
| Expiry date | Apr 16, 2004 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B2237/86
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The invention provides a hard solder alloy for bonding oxide ceramics to each other or to metal, particularly to alloy steels. The hard solder alloy comprises 65-80% copper, 15-35% titanium, 0.5-5% aluminum and 0.5-5% vanadium. The invention also provides a method of bonding the surfaces utilizing said hard solder alloy as the soldering alloy. The invention further provides a preferred method in which the said hard solder alloy is provided in the form of two components, namely copper and the alloy TiAl.sub.6 V.sub.4.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.