Microminiature semiconductor valve
US4581624A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Mar 1, 1984 |
| Grant date | Apr 8, 1986 |
| Priority date | — |
| Expiry date | Mar 1, 2004 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T137/2213
- WIPO fieldMechanical elements
- WIPO sectorMechanical engineering
Abstract
A microminiature valve having a multilayer integral structure formed on a semiconductor substrate. The valve comprises a semiconductor substrate having inlet and outlet apertures and a raised valve seat. The substrate is overlayed with a nonporous top layer and an intermediate layer. The central portion of the intermediate layer is preferentially etched away to form an enclosed chamber connecting said inlet and outlet ports. The unetched portion of said intermediate layer peripherally supports said top layer above the valve seat. An electrically conductive electrode disposed on the unsupported portion of the top layer permits it to be electrostatically deflected to engage the valve seat and close the valve.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.