High density interconnect system
US4582374A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 26, 1981 |
| Grant date | Apr 15, 1986 |
| Priority date | — |
| Expiry date | Oct 26, 2001 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R12/526
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A high density interconnect system is described which comprises a laminated board including a conductive power plane and a ground plane insulated from each other and containing a series of holes therethrough. Signal contacts, ground contacts, power contacts, data bus interconnect contacts, and feed-through contacts are selectively mounted in the series of holes with the ground contacts and power contacts connected to the respective ground plane and conductive power plane and the other contacts insulated therefrom. Front contact housings are secured against the laminated board means and contain spring-loaded contacts in openings therein for electrical engagement with the signal contacts and for electrical engagement with pins of a signature board. Rear contact housings house contact sections of the signal, power, ground, and data bus interconnect contacts to which input/output connectors of computer boards are connected for supplying power thereto, and operating signals from the computer boards are transmitted via the signal contacts to the signature board which conducts tests on the board under test to test the same. A cam-operative apparatus moves a platen carrying the signature b…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.