Method of providing an adherent metal coating on an epoxy surface
US4582564A · kind A · utility
63Cited by
24References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 20, 1983 |
| Grant date | Apr 15, 1986 |
| Priority date | — |
| Expiry date | Oct 20, 2003 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/095
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of forming adherent metallized coatings on a substrate which is useful for the manufacture of printed circuit boards as well as other metal coated articles involves providing the substrate with a rubber-modified epoxy surface or coating, sputter etching at least 50 A. from the surface followed by vacuum depositing an adherent thin metal film of Cr, Ni, Ni-V alloy, Pt, Pd or Ti onto the substrate. Another metal layer is then provided over the adherent thin film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.