Plating bath and method for electroplating tin and/or lead
US4582576A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 26, 1985 |
| Grant date | Apr 15, 1986 |
| Priority date | — |
| Expiry date | Mar 26, 2005 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3473
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An aqueous acidic plating bath for electrodeposition of tin, lead or tin-lead alloys on a substrate is described. The plating baths are free of fluoborate and comprise (a) at least one bath-soluble metal salt selected from the group consisting of a stannous salt, a lead salt, or a mixture of stannous and lead salts, (b) at least one alkane sulfonic acid or alkanolsulfonic acid, (c) at least one nonionic, cationic or amphoteric surfactant, (d) an effective amount of at least one primary brightening agent selected from the group consisting of aromatic aldehydes, acetophenones, and carbonyl compounds having the general formula EQU Ar--C(H).dbd.C(H)--C(O)--CH.sub.3 (III) wherein Ar is a phenyl, naphthyl, pyridyl, thiophenyl or furyl group, and (e) an effective amount of a secondary brightening agent selected from the group consisting of lower aliphatic aldehydes and substituted olefins of the formula ##STR1## wherein R.sub.1 is a carboxy, carboxamide, alkali metal carboxylate, ammonium carboxylate, amine carboxylate or allyl carboxylate, and R.sub.2, R.sub.3 an R.sub.4 are each independently hydrogen or lower alkyl groups. Methods for the electrodeposition of tin, lead, or tin-lead all…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.