Automated burn-in board unloader and IC package sorter
US4584764A · kind A · utility
13Cited by
3References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 8, 1985 |
| Grant date | Apr 29, 1986 |
| Priority date | — |
| Expiry date | Mar 8, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53274
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
There is disclosed herein an apparatus for unloading IC packages from sockets on a burn-in board according to predetermined performance grades. The IC packages are displaced from the sockets by inserting tools through passageways extending through the burn-in board and socket to contact the underside of the IC package and push the IC package from its socket. Sorting is accomplished by collecting the displaced IC packages of a particular grade and storing them separate from all other IC packages.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.