Component inspection by self generated transient stress wave detection
US4584879A · kind A · utility
9Cited by
3References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 18, 1984 |
| Grant date | Apr 29, 1986 |
| Priority date | — |
| Expiry date | Jun 18, 2004 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N29/14
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of inspecting a component in which the surface of the component is scanned with a loud speaker, the sonic output of which is arranged to be at such a frequency or frequencies as to cause any cracks, fractures or unbonded regions within the component to generate transient stress wave emissions. An acoustic emission transducer is attached to the component surface so as to detect any such transient stress wave emissions and thereby provide evidence of the existence of any such cracks, fractures or unbonded regions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.