Process for producing printed circuit board
US4585502A · kind A · utility
23Cited by
4References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 14, 1985 |
| Grant date | Apr 29, 1986 |
| Priority date | — |
| Expiry date | Feb 14, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for producing a printed circuit board characterized by forming a thermosetting resin layer on internal walls of through holes before an electroless plating treatment can produce printed circuit boards having high reliability without causing blow-holes on the through hole walls.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.