Electrical subassembly structure
US4586764A · kind A · utility
14Cited by
6References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 7, 1985 |
| Grant date | May 6, 1986 |
| Priority date | — |
| Expiry date | Jan 7, 2005 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/658
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electrical subassembly structure of two substrates has metalized portions located adjacent to the upper and lower edges on the back of each substrate. Clip on leads are attached to one substrate with a portion of each lead soldered to the lower edge metalized portion. The two substrates are electrically and mechanically joined by soldering upper edge metalized portions together and soldering the lower edge metalized portions of the other substrate to the lead portions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.