Patent · US Expired

Application of block copolyester amides as thermoplastic adhesives for textiles

US4588785A · kind A · utility

4Cited by
5References
15Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 3, 1985
Grant dateMay 13, 1986
Priority date
Expiry dateJul 3, 2005

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08G69/44
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

Block copolyester amides having improved properties are applied as thermoplastic adhesives to textiles. Their melting points are between 80.degree. and 135.degree. C. and the block copolyester amides are prepared by polycondensing: PA0 (A) 60 to 95% by weight of a block polyester having terminal hydroxy groups and consisting of at least 50 molar % of the acid proportion of terephthalic acid and 40 to 90 molar percent of an alcohol proportion of 1.4-butanediol and 60 to 10 molar percent of 1.6-hexanediol, wherein up to 10 molar percent referred to 1,6-hexanediol can be replaced by aliphatic diols with longer chains; and PA0 (B) 40 to 5% by weight of a block polyamide dicarboxylic acid having a mean molecular weight M.sub.n between 1,000 and 8,000 and obtained from omega-amino-carboxylic acids or lactams having 6 to 12 carbon atoms or their mixtures with aromatic or aliphatic dicarboxylic acids.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.