Metallizing of plastic substrata
US4590115A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 13, 1982 |
| Grant date | May 20, 1986 |
| Priority date | — |
| Expiry date | Dec 13, 2002 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24628
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Plastic substrata are metallized, preferably by direct electrolytic metallization, by (i) providing a plastic shaped article comprising intimate admixture of a polymeric resin and a plurality of small metallic filler particles of a non-conductive oxide of a non-noble metal uniformly dispersed therethrough, at least one of the face surfaces of said shaped article having exposed thereon such high density of said metallic filler particles as to provide in step (ii) metallization growth nuclei adapted for direct electrolytic metallization; (ii) next subjecting said at least one face surface of said plastic shaped article to the action of a reducing agent to essentially quantitatively convert the non-conductive metal oxide filler particles to conductive free metal, metallization growth nuclei; and (iii) thence electrochemically and/or electrolytically metallizing the at least one reduced face surface of said plastic shaped article with a free metal deposit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.