Package for electronic device and method for producing same
US4590672A · kind A · utility
6Cited by
18References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 20, 1982 |
| Grant date | May 27, 1986 |
| Priority date | — |
| Expiry date | Jul 20, 2002 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12889
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package having an enclosure for accommodating an electronic device, and the process of producing same. The process comprises the steps of providing a lead frame which has at least a final layer electroplated on the outerlead area thereof; bonding an electronic device in the enclosure; connecting the electronic device with an innerlead area of the lead frame by means of wires; and, thereafter, sealing the enclosure with fused glass in such a manner that the outerlead area extends out of the glass.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.