Patent · US Expired

Process for the direct bonding of metal to ceramics

US4591401A · kind A · utility

32Cited by

5References

4Claims

0Family size

Assignee

Brown, Boveri & Cie AG · DE

Inventors

Arno Neidig · Plankstadt, DE
Klaus Bunk · Ahlhorn, DE
Karl Thiele · Peine, DE
Georg Wahl · Rodenbach, DE
Jens Gobrecht · Wustrow, DE

Key dates

Filing date	Jun 28, 1984
Grant date	May 27, 1986
Priority date	—
Expiry date	Jun 28, 2004

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T156/1064
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

In directly bonding a metal to ceramics, in accordance with the invention, that surface of a metal component which is to be bonded by heating to a ceramic substrate is provided with parallel-running grooves before the preoxidation. The grooves make it possible to optimize the quantity of oxygen available at the bonding location and provide good flow behavior of the melt. As a result, a bond with good adhesion is obtained. Moreover, there is no formation of a thicker oxide layer on the free smooth surface of the metal component.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.