Thermosetting resin composition
US4591623A · kind A · utility
6Cited by
6References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 12, 1985 |
| Grant date | May 27, 1986 |
| Priority date | — |
| Expiry date | Jun 12, 2005 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08F283/10
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermosetting resin composition, which is characterized by mixing 5 to 300 parts by weight of tri-functional vinyl monomer and 0.1 to 10 parts by weight of phenoxy resin with respect to 100 parts by weight in total of an epoxy compound containing in its molecule at least two epoxy groups and a curing agent for said epoxy compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.