Curing composition containing polyether having reactive silicon-containing group and a (meth)acrylate polymer
US4593068A · kind A · utility
59Cited by
6References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 18, 1983 |
| Grant date | Jun 3, 1986 |
| Priority date | — |
| Expiry date | Oct 18, 2003 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31797
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A curing composition which comprises (A) a polyether having at least one reactive silicon-containing group in the molecule and (B) an acrylate polymer and/or an methacrylate polymer. The composition of the present invention has excellent weatherability, adhesive property, initial tackiness, especially at a low temperature, cohesive force, workability and stickness and is useful as a pressure sensitive adhesive, a sealing material, and the like.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.