Thin film transducer
US4593334A · kind A · utility
2Cited by
3References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 2, 1983 |
| Grant date | Jun 3, 1986 |
| Priority date | — |
| Expiry date | May 2, 2003 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/3166
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A film transducer head design is formed on a substrate where the first yoke layer and electric terminal strip that connects the coil center pad to the head exterior are formed at the same time followed by successive layers that form the transducer gap, coil insulation, coil, coil insulation and the second yoke layer. This sequence allows the coil to be tested immediately after deposition of the coil material and at a time in the fabrication sequence when it can be reworked or replaced if a discontinuity (open) or shorted turn(s) is (are) identified.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.