Process for the photoselective metallization on non-conductive plastic base materials
US4594311A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 29, 1984 |
| Grant date | Jun 10, 1986 |
| Priority date | — |
| Expiry date | Oct 29, 2004 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2035/0855
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Catalytically imaged thermosetting and thermoplastic resin objects including printed circuit boards are provided. A hydrophilic, adhesion promoted insulating base material is treated in selected areas to produce metallic nuclei in the form of an image of a desired metal pattern. The image is exposed to an electroless metal bath to reinforce the image. Then, the non-imaged areas of the base are rendered hydrophobic by means of solvent treatment. The imaged areas are built up by metal deposition. Preferably, the solvent treatment of the non-imaged areas of the base material is repeated to enhance adhesion of the metal pattern to the base material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.