Electrical component encapsulation package
US4594644A · kind A · utility
45Cited by
8References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 22, 1984 |
| Grant date | Jun 10, 1986 |
| Priority date | — |
| Expiry date | Oct 22, 2004 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01H50/023
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electrical component encapsulation package including a cover; a base including a peripheral frame with a large central hole; and support means for mounting the electrical component above and spaced from the frame for providing an open space between the frame and component for introduction and flow of encapsulating material, and to insure integrity of the electrical connections.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.