Organic solvent-soluble photosensitive polyamide resin
US4595745A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 21, 1984 |
| Grant date | Jun 17, 1986 |
| Priority date | — |
| Expiry date | Jun 21, 2004 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0387
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An organic solvent-soluble photosensitive polyamide resin usable for producing photoset resin product having excellent heat resistance and electrical and mechanical properties, comprising a polycondensation product of an aromatic dicarboxylic acid component with an aromatic diamine component consisting of 10 to 100 molar % of a photosensitive diamine compound of the formula (I) and 10 to 90 molar % of a non-photosensitive diamine compound of the formula (II), EQU H.sub.2 N--R.sub.1 --NH.sub.2 (I) EQU H.sub.2 N--R.sub.2 --NH.sub.2 (II) wherein R.sub.1 represents an aromatic divalent residue having a photosensitive radical and R.sub.2 represents an armoatic divalent residue having no photosensitive radical.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.