Apparatus for laminating multilayered printed circuit boards
US4596624A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 2, 1984 |
| Grant date | Jun 24, 1986 |
| Priority date | — |
| Expiry date | May 2, 2004 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/068
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus for laminating multilayered printed circuit boards while radically reducing the volume of inert gas that must otherwise be used to effect the lamination process. The invention employs a novel ring assembly, each such assembly disposed on a moveable, horizontally disposed shelf. Each such ring assembly comprises a hollow circular cylinder, the interior of which is adapted to radially enclose a multiple layer circuit module mounted on a heating platen. The axial surfaces of the cylinder are capped by a pair of seal plates and O-rings to form a gas-tight laminating chamber. Each shelf is adapted to travel vertically along a pair of support tubes whereby the entire array of shelves may be compressed relative to the respective shelves by a hydraulic or pneumatic cylinder the rod of which is affixed to the bottom surface of the lowermost shelf.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.