Electronic thin-film circuit and method for producing it
US4596762A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jun 2, 1983 |
| Grant date | Jun 24, 1986 |
| Priority date | — |
| Expiry date | Jun 2, 2003 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0505
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic thin-film circuit having a substrate plate comprising an insulating material and having a resistance film partially covering the substrate plate is proposed. The resistance film forms a first pattern and a second pattern. The first pattern defines tracks and/or connection contacts, while the second pattern defines circuit elements of the electronic thin-film circuit. A metal film which is capable of being soldered and of being reinforced by electroplating is disposed above the resistance film in the vicinity of the first pattern. Inside the first pattern, a soft-solder film is applied to parts of the metal film which is capable of being soldered and of being reinforced by electroplating, in order to form tracks and/or connection contacts which are reinforced with soft solder. A gold film is applied to other parts, not coated with soft solder, of the metal film which is capable of being soldered and of being reinforced by electroplating, inside the first pattern, in order to form tracks and/or connection contacts which are reinforced with gold. A bonding wire is secured to the gold film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.