Encapsulation molding apparatus
US4599062A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 17, 1984 |
| Grant date | Jul 8, 1986 |
| Priority date | — |
| Expiry date | Dec 17, 2004 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C45/02
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The disclosure is directed to an encapsulation molding apparatus to be used for subjecting small-sized electrical elements to encapsulation molding by a synthetic resin material. The present invention has been presented for the purpose of shortening the cycle time required for the encapsulation molding, and also, reducing cost necessary for molding metal molds, and installation cost for a molding press, etc., with a simultaneous reduction of a loss in the synthetic resin material. More specifically, in the apparatus of the present invention, for subjecting small-sized electrical elements to encapsulation molding by the synthetic resin material, pots (30) for charging the synthetic material thereinto are provided at preferably equal intervals with respect to a plurality of cavities provided in an upper mold (11) and a lower mold (12) for the formation of encapsulation molded portions, while extruding plungers (31) are provided for the respective pots for effecting the encapsulation molding. The apparatus according to the present invention may be advantageously employed as a resin encapsulating apparatus for semi-conductor devices, etc.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.