Resin composition
US4599155A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 21, 1984 |
| Grant date | Jul 8, 1986 |
| Priority date | — |
| Expiry date | Sep 21, 2004 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01B3/46
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
There is disclosed a resin composition comprising PA0 (A) a spiro ortho ester compound and/or a spiro ortho carbonate compound; PA0 (B) an aluminum compound; and PA0 (C) a silanol compound or a silicon compound which is capable of generating a silanol group; the amounts of components (B) and (C) being within the range of 0.001 to 10% by weight and 0.1 to 20% by weiht, based on the amount of component (A), respectively. The resin composition of this invention is excellent in volumetric shrinkage performance at curing operation and is good in storability. Therefore, the cured product can be used for a wide variety of industrially valuable applications, such as an ink, a coating, an adhesive, a surface coating, an encapsulation and an electrical insulating material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.