Hot-melt adhesive as intermediate layer of a laminate structure
US4600648A · kind A · utility
14Cited by
2References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 23, 1985 |
| Grant date | Jul 15, 1986 |
| Priority date | — |
| Expiry date | Apr 23, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31913
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Disclosed is a hot-melt adhesive composed of a composition comprising an acid-modified olefin resin formed by graft modification of an ethylenically unsaturated carboxylic acid or its anhydride or a resin composition containing said modified olefin resin and an oxirane ring-containing compound, wherein said composition has a carbonyl group concentration of 1 to 600 millimoles per 100 g of the composition and an oxirane oxygen concentration of 0.01 to 50 millimoles per 100 g of the composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.