Semiconductor device package having regions of different thermal properties
US4600968A · kind A · utility
20Cited by
7References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 13, 1984 |
| Grant date | Jul 15, 1986 |
| Priority date | — |
| Expiry date | Nov 13, 2004 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In the particular embodiments of the invention described in the specification, a semiconductor package is made from two modules, one containing a semiconductor element having a high allowable temperature and the other containing a circuit component having a lower allowable temperature. The modules are combined by corresponding embossed and recessed surfaces or by pin connection or by a connecting screw.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.