Leadless chip carriers having self-aligning mounting pads
US4600970A · kind A · utility
30Cited by
8References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 29, 1984 |
| Grant date | Jul 15, 1986 |
| Priority date | — |
| Expiry date | May 29, 2004 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A pad configuration for surface mounted components having contact pads along the periphery thereof includes a plurality of interior pads distributed in a grid with the period of interior pads being three quarters of the period of the peripheral pads multiplied by an integer greater than 1.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.