Heat conduction mechanism for semiconductor devices
US4602314A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Oct 14, 1983 |
| Grant date | Jul 22, 1986 |
| Priority date | — |
| Expiry date | Oct 14, 2003 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20454
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides a mechanism for conducting heat away from a semiconductor device, and has particular application for use with VLSI technology. The present invention comprises an elongated, resilient and deformable central body having a thermally conductive outer surface which is disposed in contact with a surface of the semiconductor device. In the preferred embodiment, the semiconductor devices comprising an electronic circuit configuration are disposed on a circuit board in rows. The present invention is formed into strips such that one strip of the central body portion of the present invention is disposed over each row of semiconductor devices. A heat sink is placed over the central body portion of the present invention such that the central body with its thermally conductive outer surface is sandwiched between an upper surface of the semiconductor device and the heat sink. Heat generated by the semiconductor device is conducted through the thermally conductive outer surface of the resilient central body to the heat sink where it is radiated and conducted away from the semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.