Device for soldering printed board
US4602730A · kind A · utility
11Cited by
4References
4Claims
0Family size
Inventors
Key dates
| Filing date | May 22, 1984 |
| Grant date | Jul 29, 1986 |
| Priority date | — |
| Expiry date | May 22, 2004 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1581
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Device for soldering a printed board, equipped with a printed substrate conveyor, which effects soldering of chip parts on a printed substrate by moving the printed substrate through a molten solder wave formed by providing a nozzle in a solder tank accommodating molten solder, and a vibration imparter for giving vibration to the printed substrate when it is passing through the molten solder wave.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.