Printed circuit boards of laminated thermosetting sheets

US4604314A · kind A · utility

Assignee

• Siemens Aktiengesellschaft · DE

Inventors

• Wolfgang von Gentzkow · Kleinsendelbach, DE
• Maximilian Hodl · Munich, DE
• Wolfgang Kleeberg
• Helmut Markert · Nuremberg, DE

Key dates

• Filing date: Jan 25, 1985
• Grant date: Aug 5, 1986
• Expiry date: Jan 25, 2005

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T442/3585
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

Improved printed circuit boards of laminated thermosetting sheets with epoxy resin as the bonding agent contain for inhibiting copper migration 0.1% to 10% N,N'-bis-salicyloyl hydrazine, based on the weight of the hardened epoxy resin.