Thermosetting epoxy resin compositions
US4604435A · kind A · utility
13Cited by
8References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 16, 1984 |
| Grant date | Aug 5, 1986 |
| Priority date | — |
| Expiry date | Nov 16, 2004 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L63/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
What is disclosed are thermosetting epoxy resin compositions containing block siloxane copolymers which are used to induce low internal stress in the cured compositions and to provide coefficients of thermal expansion more closely aligned with the coefficients of thermal expansion of the substrates being molded therewith.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.